Session7 Image Sensors and Ranging.pdf

1、ISSCC 2026SESSION 7Image Sensors and Ranging7.1:5442 LiDAR 3D-Stacked System-On-Chip with On-Chip Point Cloud Processing and Hybrid On-Chip/Package-Embedded 25V Boost Generation 2026 IEEE International Solid-State Circuits Conference1 of 515442 LiDAR 3D-Stacked System-On-Chip with On-Chip Point Clou

2、d Processing and Hybrid On-Chip/Package-Embedded 25V Boost GenerationNeale A.W.Dutton1,Xavier Branca2,Mathieu Thivin2,Steven Collins1,Herve Thuaire2,Fabrice Martin2,Vincent Clemencon2,Mohammed Al-Rawhani1,Duncan Hall1,Axel Crocherie1,Cedric Pastorelli1,Sophie Taupin2,Severin Trochut2,Abhishek Singh1

3、,Andreas Amann1,Bruce R.Rae1,Pascal Mellot21-STMicroelectronics,Edinburgh,United Kingdom 2-STMicroelectronics,Grenoble,France7.1:5442 LiDAR 3D-Stacked System-On-Chip with On-Chip Point Cloud Processing and Hybrid On-Chip/Package-Embedded 25V Boost Generation 2026 IEEE International Solid-State Circu

4、its Conference2 of 51Outline Applications and Background Pixel Overview System on Chip Overview Sensor Timing Modes Embedded 25V Generation Results Conclusion7.1:5442 LiDAR 3D-Stacked System-On-Chip with On-Chip Point Cloud Processing and Hybrid On-Chip/Package-Embedded 25V Boost Generation 2026 IEE

5、E International Solid-State Circuits Conference3 of 517.1:5442 LiDAR 3D-Stacked System-On-Chip with On-Chip Point Cloud Processing and Hybrid On-Chip/Package-Embedded 25V Boost Generation 2026 IEEE International Solid-State Circuits Conference4 of 511000 cm30.5 cm37.1:5442 LiDAR 3D-Stacked System-On

6、-Chip with On-Chip Point Cloud Processing and Hybrid On-Chip/Package-Embedded 25V Boost Generation 2026 IEEE International Solid-State Circuits Conference5 of 51Mini-LiDAR ApplicationsConsumerAR/VR/MRRobotics&IndustrialLocation&Mapping7.1:5442 LiDAR 3D-Stacked System-On-Chip with On-Chip Point Cloud