20260219_B-202_Stevens.PDF

1、February 2026Ashley Stevens,Director of Product Management and MarketingChiplet Summit,Santa Clara Convention CenterEnabling Scalable Multi-Die Systems for AI,HPC,and Automotive ADAS 2026 Arteris,Inc.All rights reserved.1Chiplets Enable AI Compute Growth at More than Moore Speed 2026 Arteris,Inc.All

2、 rights reserved.2Moores Law:Coming to an EndPreviously doubling every 2 yearsAI Compute Era:Doubling in 6 months!PETAFLOPS/S-DAYSMore ComputeNode Shrink,Lithography Scalability Scale device larger than a single die Cost Multiple smaller dies increase yield and reduces costs Portfolio of products Mi

3、x and match dies to differentiate product portfolio Ecosystem Multi-vendor interoperabilityThe Multi-Die Paradigm ShiftThe Chiplet Revolution Enables:2026 Arteris,Inc.All rights reserved.3 Chiplets today are primarily used by integrated CPU,GPU and AI chip vendors Next steps:Small closed ecosystems,

4、thenopen standards-based ecosystems Die-to-die interconnects can be coherent or non-coherent and homogeneous or heterogeneous Ncore Multi-Die option addresses coherent use cases:Both homogeneous and heterogeneous Non-coherent transactions can be supported over coherent die-to-die NoCChiplet Use Case

5、s And Markets 2026 Arteris,Inc.All rights reserved.4CoherentNon-coherentHomogeneousHeterogeneousServersNon-coherent acceleratorsFPGACoherent acceleratorsMemory expansionCommunications&I/O Industrial&automotiveNcore Multi-DieAXI PacketizationCXL Type 3/PCIeHomogeneous&SymmetricHeterogeneous&Asymmetri

6、cHeterogeneousSystemsIdentical chipletsPre-planned topologiesCustom D2D ProtocolSmall number of chipletsLimited mix-and-matchCustom D2D ProtocolHub configurationOpen chiplet ecosystemInteroperable D2D ProtocolProgressive Complexity in Chiplet Assemblies 2026 Arteris,Inc.All rights reserved.5Die ADie