20260219_F-202_Pusch.PDF

1、Commercial Space SWAP Savings with 2.5D Heterogeneous Integration of Intel 18A Stephanie PuschDeniz CivaySatish SuranaDavid DoanLalit GajareTressa MarquardtRavi GutalaDarin HeckendornBryan LaPointeHigh Density Packaging Needs for Commercial SpaceBenefits of 2.5D HIChiplet Based SiP Demonstration wit

2、h EMIBIntel 18A and EMIB TechnologyCadence 2.5D HI FlowEngaging with TSS3Trusted Semiconductor SolutionsSize,Weight,and Power(SWAP)Drive Cost of Microelectronics for Commercial Space The global space economy reached$613 billion in 2024,reflecting strong 7.8%year-over-year growth,with the commercial

3、sector accounting for 78%of the total Continued growth is expected with the space market predicted to exceed$1 trillion as soon as 2032 The commercial space market includes CubeSats,Small Satellites,and Large Commercial Platforms with electronic payloads ranging from a few pounds to 1,000 pounds SWA

4、P savings are impetrative to successful CubeSat(and SmallSat)missions Key SWaP metrics:1U:1,000cm3,300-700g,1W6U:3,000cm3,7-8kg,10-30W1U CubeSat6U CubeSat4Trusted Semiconductor SolutionsReducing SWAP of Microelectronics without Compromising Performance Miniaturization Technologies System-on-Chip 2.5

5、D/3D Heterogenous Integration(HI)or System-in-Package Power Efficiency Intelligent power management Use of advanced,low power technology Radiation Tolerance Use of COTS radiation hardened components Upscreening of commercial electronicsSiP Assembly with Intel EMIB5Trusted Semiconductor SolutionsWher

6、e 2.5D Wins in the Market2D PCB2.5D HI3D HIForm FactorPerformanceThermal EfficiencyIdeal for applications requiring thermal management *https:/dnn- P T I M I Z E D:Interconnect densityBandwidthPower EfficiencyHPC,AI Accelerators,NetworkingMobile SoCs,HBM,WearablesCubeSatsSmallSatsLargeSats6Trusted S