20260219_F-202_Sloan.PDF

1、Design and Analysis of EMIB Silicon Bridge with Hatched Ground PlanesLynn Sloan,Keysight TechnologiesHeeSoo Lee,Keysight Technologies Ravi Gutala,Intel FoundryLalit Gajare,Intel FoundryXenofon Konstantinou,Intel Foundry Embedded Multi-Die Interconnect Bridge(EMIB)2EMIB has three key benefits:It enab

2、les large heterogeneous die complexes with highly customizable layouts It supports high-data-rate signaling between adjacent dies while using simple driver/receiver circuitry It allows optimizing each die-to-die link individually by customizing the bridge for each linkTypical EMIB Package Layout 3Vi

3、asInterconnectHatched Power or Ground Return PathOne Layer Cookie Cut Sample EMIB Layout With Hatched Power and Ground Return PathsEMIB Modeling ChallengesComplex design,modeling,and simulation due to hatched ground planesSignificant computational resource requirements with conventional fullwave EM

4、extractionLong modeling/simulation time:days of simulation time instead of minutesLimited solutions for the full bus,ex UCIe 1 or 2 modules,modeling and analysis of crosstalkDifficult design space exploration System level channel validation such as VTF from UCIe standard4Proposed Solution:A Mixed-Do

5、main Modeling Approach for Hatched Power and Ground Return Paths5Layout is“Cookie Cut”into sections with vertical interconnects of via level transitions and solder bumps and longer transmission interconnects in hatched planesFull-wave 3D FEM simulation for via transition regions(Vertical Interconnec

6、ts)*These critical regions,which demand the highest accuracy,are solved using the full-wave FEM(Finite Element Method)solver.Specialized quasi-static 2D EM simulation for uniform traces on the hatched ground plane*The longer transmission line sections are efficiently modeled using less computational