20260219_A-201_Jose.PDF

1、Chiplet Summit 2026Title:Managing Workloads in Chiplet Based Data Centers using Digital TwinsPresenter:Deepak Shankar|LinkedInPresenter:Tom Jose|LinkedInPRESENTATION OUTLINE01The Chiplet RevolutionWhy data centers are shifting from monolithic to chiplet-based architectures02Challenges at ScaleSystem

2、-level tradeoffs in compute,memory,interconnect,power,and thermal03Data Centre Digital Twin ArchitectureScalable modeling from chiplets to pods with parameterized workloads04Key Results&MetricsQuantified benefits across scheduling,interconnect,memory,and power05Design Rules&ConclusionsActionable gui

3、delines for chiplet-based data center deploymentTHE CHIPLET REVOLUTION IN DATA CENTERSFrom Monolithic to ModularModern data centers now integrate modular chiplet-driven systems connecting diverse silicon dies through advanced interconnects,replacing traditional monolithic server architectures.CPUsGe

4、neral computeGPU ModulesNVIDIA DGX B300Memory ChipletsDisaggregatedDPUsData processingINTERCONNECT FABRICUCIeUniversal Chiplet Interconnect Express die-to-die within packageNVLinkGPU-to-GPU high-bandwidth interconnect for aggregated computePCIe/CXLHost-to-device connectivity and memory expansion pro

5、tocolsSpectrum-XHigh-performance Ethernet switching for distributed AI trainingWHY CHIPLETS?KEY ADVANTAGESDomain-OptimizedSiliconEach chiplet is purpose-built for its function compute,memory,I/O enabling best-in-class performance per tile.Greater YieldPer WaferSmaller dies have exponentially higher

6、manufacturing yield than monolithic designs,reducing cost per good die.FieldUpgradeabilityIndividual chiplets can be swapped or upgraded without replacing the entire system,extending platform lifecycle.Thermal&PowerPartitioningFine-grained control over power delivery and cooling per chiplet,enabling