拓展视野——数据中心市场展望及联发科领先的AI ASIC技术.pdf

1、Copyright MediaTek Inc.All rights reserved.Hao Ming Chao(Chris)S R.P R O D U C T M A R K E T I N G M A N A G E R,M E D I A T E KExpanding HorizonsData Center Market Outlook&MediaTeks Data Center ASIC SolutionsO C P 2 0 2 5Copyright MediaTek Inc.All rights reserved.2AgendaO C P A G E N D A12Training

2、Compute TrendEvolution of DC Compute3Silicon Complexity4Interconnect Complexity5CPO Advancements6MediaTeks Data Center ASIC SolutionsCopyright MediaTek Inc.All rights reserved.3Generative AI(LLM)Drives Exponential Model Training GrowthVsP H Y S I C A L D E S I G N =X 2 /Y E A RComputing TOPsIntercon

3、nect BW GB/sMemory HBM BW GB/sx 2x 2x 2Source:NVIDIA 2024 GTC by JensenT R A I N I N G C O M P U T E T R E N D =X 1 0/Y E A RCopyright MediaTek Inc.All rights reserved.4Evolution of Data Center ComputeW A V E 1:CPU ERAW A V E 2:GPU ERAW A V E 3:DOMAIN SPECIFIC ERA Single core to multi-core Multi thr

4、eaded SW,Virtualization Moores Law scaling 130um,Interposer:40m)Ball fanout limitation(Pitch:900 m)Large Interconnect IPDense pitch(CPC pitch:400um)Large Interconnect IPInterconnect bandwidth per chip2X every 2 years20Tb40Tb60Tb80Tb100Tb200Gb x 48+lanes(9.6T)200-300Gb x 96+lanes (28.8T)CPO is requir

5、edNext gen xPUs400Gb x 192+lanes(76.8T)Copyright MediaTek Inc.All rights reserved.82024 vs.2025:MediaTeks CPO advancementsHeterogeneous Integration6.4T Optical+6.4T Copper 12.8Tbps 400G-DR4 compliant 112Gbps LR SERDES Direct drive Serviceability Options w/external and internal lasersMediaTeks EIC,PI

6、CUp to 400Gbps per fiberSocketed solution for serviceability with detachable connector2 0 2 42 0 2 42 0 2 52 0 2 5Copyright MediaTek Inc.All rights reserved.9V O L U M E P R O D U C T I O NA R C H I T E C T U R E P H A S ED E S I G N P H A S ED A T A C E N T E R S O L U T I O N S