冷却环境面板.pdf

1、John Fernandes-METACosimo Pecchioli BP CastrolSean Sivapalan-NVIDIAWelcome to the Cooling Environments ProjectWelcome to the Cooling Environments ProjectJohn Fernandes-METACosimo Pecchioli BP CastrolSean Sivapalan-NVIDIASteve Mills-METACOOLING ENVIRONMENTS&LIQUID COOLINGCOOLING ENVIRONMENTS&LIQUID C

2、OOLINGCooling Environments LeadershipCosimo PecchioliOCP CE Co-LeadIT Hardware&OEM Partnership,bp/CastrolSean SivapalanOCP CE Co-LeadMaterials Engineer,NVIDIA CorporationJohn FernandesOCP CE Co-LeadThermal Engineer,Meta Platforms Inc.COOLING ENVIRONMENTS&LIQUID COOLINGSteering Committee Representati

3、veSteve Mills(Meta)Cooling EnvironmentsSean Sivapalan(Nvidia),Cosimo Pecchioli(BP/Castrol)&John Fernandes(Meta)Cooling Environments OverviewDoor Heat ExchangersJabari George(JM Gross Engineering)&Martin Doerrich(Rittal)Cold PlateBerhanu Wondimu(Intel)&Emily Clark(Dell)ImmersionRolf Brink(Promersion)

4、&Jessica Gullbrand(Intel)Heat ReuseJaime Comella(AQ Compute)&Bharath Ramakrishnan(Microsoft)CDUJohn Menoche(Vertiv)&Matt Koukl(AEI)Cooling Environments Overview:SubProjectsImmersionCold PlateRear Door Heat ExchangerHeat Re-useAdvanced Cooling FacilitiesCooling Environments Overview:SubProjectsImmers

5、ionCold PlateRear Door Heat ExchangerHeat Re-useAdvanced Cooling FacilitiesCooling Environments Overview:SubProjectsImmersionCold PlateDoor Heat ExchangerHeat Re-useAdvanced Cooling FacilitiesCooling Environments Overview:SubProjectsImmersionCold PlateRear Door Heat ExchangerHeat Re-useAdvanced Cool

6、ing FacilitiesCooling Environments Overview:SubProjectsCooling Environments Overview:SubProjectsImmersionCold PlateRear Door Heat ExchangerHeat Re-useCDUCooling Environments FactsCooling Environments DemographicsOver 3,000 participantsWorkstream:High Velocity