两相微柱蒸发器助力下一代GPU服务器冷却.pdf

1、Dr.Qingyang Wang,Dr.Richard BonnerAccelsiusTwo-Phase Micropillar Evaporators to Enable Cooling of Next-Generation GPU ServersTeamQingyang Wang,Richard Bonner(Accelsius)Dereje Agonafer,Sai Abhideep Pundla,Braxton Smith(UT Arlington)Damena Agonafer,Vivek Manepalli,Kidus Guye(University of Maryland)Her

2、mann von Drateln,Robert Fernandez,Bill Boudsamad(Celestica)Pumped two-phase direct-to-chip cooling enables the surging power densities of GPUs and server racksProcessor TDP already exceeding 1 kW600 kW racks are coming with new architecturesA complete system consisting of advanced evaporators and CD

3、Us is needed to offer the best performanceDirect-to-chip evaporative cooler(DCEC)dissipating 400 W/cm2of heat fluxTwo-phase CDUs enabling 250 kW racksCombined cooling performance for advanced AI serversSummaryOverviewProcessor power/heat flux are surgingRack power reaching 600 kW in 2027The Market N

4、eedLiquid Cooled Kyber Rack with Vertical Servers Set for Deployment 2027,Per NVIDIA at GTC March 2025Advantages of pumped two-phase(2P)direct-to-chip(DTC)coolingSuperior heat transfer:HTC increases with heat fluxIsothermal:alleviate silicon warpageSmall coolant flow rate:pumping cost reduction and

5、erosion mitigationDielectric fluid:safety for IT equipmentOptimal system-level performance requires advancements in both evaporators and CDUsPumped Two-Phase Direct-to-Chip CoolingPicture from OCP White Paper“Pumped 2P Refrigerant-Based Direct Liquid Cooling(DLC)Technology for Next Generation AI Clu

6、sters with High TDP Accelerators”.Silicon-based hollow micropillar arrays integrated with liquid delivery layerEnable microscale evaporation of suspended dropletsSurface free energy dictates droplet positionBalance thermal resistance and hydrodynamic performanceHeat flux dissipat