TE Con​​nectivity推出面向下一代高密度AI数据中心的互连解决方案.pdf

1、Interconnect Solutions forNext-Generation High-Density AI Data CentersPranav Garg,VP Strategy,BD,MarketingGanesh Srinivasan,VP Product Management 2025 TE Connectivity.Confidential&Proprietary.Do not reproduce or distribute externally including non-authorized representatives and distributors.Create a

2、 sustainable future by limiting print copies and recycling paper.AI Model GrowthModel parameters and tokens introduced are scaling exponentially3Market Dynamics&The AI ImperativeTE is at the forefront,delivering innovative interconnect,power,and thermal solutionsto help enable scalable,high-performa

3、nce AI data centers.Compute vs.InterconnectCompute is struggling to keep pace with model growth;interconnect is critical enabler for AI performanceArchitectural ImpactThis bottleneck drives the need for GPU clustering,both scale-up and scale-outIndustry ShiftThe rise of AI,ML,and cloud computing is

4、fundamentally transforming data center architectures 2025 TE Connectivity.Confidential&Proprietary.Do not reproduce or distribute externally including non-authorized representatives and distributors.Create a sustainable future by limiting print copies and recycling paper.4Shaping the Future of Syste

5、m ArchitectureGPU DensityInterconnect SpeedRack PowerThermal LoadsManufacturing ResilienceINDUSTRY CHALLENGESSCALABLE SOLUTIONS Voltage transitioning from 40V to 400VRack power:10-30kW 120KW+600KW,1MWDevelopment of HV architectures,liquid-cooled busbars,scalable power delivery systemsDoubling every

6、1.5 years;from 224G to 448G+56G 112G 224G 448GRequires faster innovation cycles and activesignal conditioning to maintain reachDriving architectural innovation:new form factors,tighter interconnect packaging,denser designsAI workloads demand more GPUs per rack,pushing limits of space and thermal des