OBMF 工作流程内部：最新规范进展和路线图.pdf

1、Janusz Jurski,Principal Engineer,IntelBharat Pillilli,Principal HW Engineer,MicrosoftAcknowledgments:all OBMF WS membersInside the OBMF Workstream:Latest Spec Developments and RoadmapInside the OBMF Workstream:Latest Spec Developments and RoadmapJanusz Jurski,Principal Engineer,IntelBharat Pillilli,

2、Principal HW Engineer,MicrosoftAcknowledgments:all OBMF WS membersHARDWARE MANAGEMENTAgendaOBMF Workstream OverviewProblem StatementOBMF-ICP Concept Overview Specification Structure(Base Spec,Binding Specs,OBMF JSON)Specification Status Call for feedbackOBMF Workstream OverviewClosed CLA Workstream

3、under HW Management ProjectInitiated by Microsoft&Intel Joined by AMD,Aspeed,ARM,Nuvoton,NvidiaWS meetings started in Q2 2025First specs release announced by OCP Global Summit 2025Scope:A specification to prescribe the DC-SCM interface(or a list of recommended physical interfaces)and standardized pr

4、otocol for use in boot,configuration and runtime communication between Host Processor or other devices on the Host Processor Module(HPM)and Baseboard Management Controller(BMC)on the DC-SCM Module.Problem Statement Multi-Protocol&Multi-Interface Problem limits FW interoperability between CPU/Device

5、vendors-beyond regular manageability interfaces eSPIQSPI/SPII2CI3CUSBSMBusGPIODC-SCMHPM ADC-SCIBMCCPU orDeviceVendor AMulti-ProtocolsMulti-InterfacesInterfaces X,Y,ZProtocols A,B,CDC-SCMHPM BDC-SCIBMCCPU orDeviceVendor BInterfaces X,Q,YProtocols C,D,EDC-SCMHPM CDC-SCIBMCCPU orDeviceVendor CInterface

6、s W,Y,ZProtocols A,K,LTPMRTCProprietaryOBMF-Open Boot and Management FrameworkDefinition of OBMF Interface Consolidation Protocol(OBMF-ICP)Vendor Agnostic and CPU/Device Agnostic(PCIe Card,CXL Card,AMC,etc.)Physical Interface Agnostic(Protocol layer definition)Aligned to DC-SCM 2.x and Multi Node in