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1、CHIPS,NODES AND WAFERSA TAXONOMY FOR SEMICONDUCTOR DATA COLLECTIONAugust 2024 2 CHIPS,NODES AND WAFERS:A TAXONOMY FOR SEMICONDUCTOR DATA COLLECTION OECD 2024 This paper was approved and declassified by written procedure by the Digital Policy Committee(DPC)and the Committee on Industry,Innovation and

2、 Entrepreneurship(CIIE)on 26 July 2024 and prepared for publication by the OECD Secretariat.Note to Delegations:This document is also available on O.N.E.Members&Partners under the reference code:DSTI/DPC/CIIE(2024)1/FINAL This document,as well as any data and map included herein,are without prejudic

3、e to the status of or sovereignty over any territory,to the delimitation of international frontiers and boundaries and to the name of any territory,city or area.Cover image:HAKINMHAN/S OECD 2024 The use of this work,whether digital or print,is governed by the Terms and Conditions to be found at:http

4、s:/www.oecd.org/termsandconditions CHIPS,NODES AND WAFERS:A TAXONOMY FOR SEMICONDUCTOR DATA COLLECTION 3 OECD 2024 Foreword The semiconductor value chain is susceptible to disruptions that pose a considerable risk for modern economies.Better data are essential for policy makers to identify bottlenec

5、ks,monitor the balance between demand and supply of specific semiconductor types,and manage disruptions.This paper sets out a common taxonomy for semiconductor types and production facilities,to facilitate harmonised data collection and sharing.The taxonomy distinguishes semiconductor products into

6、four broad categories “logic”,“memory”,“analog”and“others”and sub-categories based on their prevalence and specific functions.Semiconductor production facilities are classified according to the technology used and ability to produce different types of semiconductors,the installed production capacity