《Team Sweden:2026全球芯片产业竞争洞察报告:全新半导体格局下瑞典的全球竞争力布局(英文版)(22页).pdf》由会员分享,可在线阅读,更多相关《Team Sweden:2026全球芯片产业竞争洞察报告:全新半导体格局下瑞典的全球竞争力布局(英文版)(22页).pdf(22页珍藏版)》请在三个皮匠报告上搜索。
1、BUSINESS SWEDEN|THE GLOBAL CHIP RACE|1Sweden in the new Semiconductor Landscape:Positioning for Global Competitiveness THE GLOBAL CHIP RACEEXECUTIVE GLOBAL INSIGHTBUSINESS SWEDEN|THE GLOBAL CHIP RACE|2EXECUTIVE SUMMARYSWEDEN AT THE SEMICONDUCTOR CROSSROADSThe semiconductor industry is undergoing a s
2、ig-nificant transformation,driven by intersecting geopolitical,technological and sustainability forces.Global supply chains,once tightly integrated and dominated by East Asia,are fragmenting into more resilient,regionally aligned ecosystems.This shift is reshaping how and where chips are designed,ma
3、n-ufactured,and distributed,introducing both new opportunities and increased risks.Geopolitical concerns have elevated semi-con-ductors to strategic national assets,essential for economic competitiveness and security.The era of hyper-globalisation is giving way to reshor-ing,near-shoring,and friend-
4、shoring,with econ-omies like the United States,China,Japan and the EU investing heavily in domestic and allied manufacturing capacity.Further adding to the complexity,new players including India,Malaysia and Vietnam are emerging in the semiconduc-tor value chain.Meanwhile,Taiwan,the United States,So
5、uth Korea,the EU and China remain central hubs in a complex,interdependent value chain that spans over a thousand of manufactur-ing steps across dozens of borders.The rapid rise of AI and other advanced tech-nologies is driving unprecedented demand for high-performance,energy-efficient chips.This ha
6、s spurred a surge in investment across chip architec-ture innovation,fabrication capacity,Co-Packaged Optics(CPO)and memory technologies like High Bandwidth Memory(HBM).Industry leaders are expanding R&D and production worldwide to meet escalating needs,yet face critical challenges including talent