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WB-BGA封装环节成本构成
WB-BGA封装环节成本构成
行业数据
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所属报告:
兴森科技-公司研究报告-IC载板龙头助力国产先进封装及高算力芯片腾飞-230315(38页).pdf
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相关数据
引线键合(左)与BGA封装(右)
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行业数据
2026-03-24
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BGA封装分类
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其它
2024-05-21
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基板封装(球栅阵列BGA和平面网格阵列LGA)
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其它
2023-12-13
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预计2021-2025年全球FC-BGA/LGA/PGA产值
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行业数据
2023-01-17
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公司规划封装基板产品从FC-CSP迈向FC-BGA
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行业数据
2022-06-02
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最新数据
全球全年龄段奶粉市场规模(亿美元)
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行业数据
2026-07-30
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全球酸奶及发酵乳制品市场规模(亿美元)
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行业数据
2026-07-30
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全球药用级益生菌市场规模(百万美元)
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行业数据
2026-07-30
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全球益生菌膳食补充剂市场规模及增速
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行业数据
2026-07-30
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全球拥有AKK专利菌株的核心企业
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行业数据
2026-07-30
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IC 载板作为先进封装中不可或缺的材料,未来发展潜力巨大。受益于半导体市场的高景气度,近年来 IC 载板市场规模发展迅速。IC 载板即封装基板是封装环节的主要成本,在低端封装中占成本的 30%以上,在高端封装中可占成本的 70%。在整个 PCB 行业的细分领域中,近几年封装基板产品是增长速度最快的一类。据Prismark 统计数据显示,2021 年全球封装基板市场规模达到 141.98 亿美元,实现同比增长 39.4%, 2022 年预计全球 PCB 增长率为 2.9%,而封装基板市场增长约23%。据 Prismark 预测,2023 年全球 PCB 市场将下降 2%,而封装基板市场可能会实现平缓增长。
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兴森科技-公司研究报告-IC载板龙头助力国产先进封装及高算力芯片腾飞-230315(38页).pdf
公司分业务收入预测
FCBGA封装基板项目规划
北京揖斐电公司发展历程
图8.可比公司毛利率情况
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