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WB-BGA封装环节成本构成_第1页
5qC55o2u5oKo5o+Q5L6b55qE5L+h5oGv77yM5Lul5LiL5piv5pWw5o2u6KGo5qC85ZKM6LWE5paZ5p2l5rqQ77yaCgojIyMg5pWw5o2u6KGo5qC8Cgp8IOaIkOacrOaehOaIkCAgIHwg55m+5YiG5q+UIHwKfC0tLS0tLS0tLS0tLXwtLS0tLS0tLXwKfCDlsIHoo4Xln7rmnb8gICB8IDMwJSAgICB8Cnwg5rWL6K+VICAgICAgIHwgMjUlICAgIHwKfCDorr7lpIfmipjml6cgICB8IDI1JSAgICB8Cnwg6KOF6YWNK+adkOaWmSAgfCAyMCUgICAgfAoKIyMjIOi1hOaWmeadpea6kArok53mtbfllYbkv6HvvIzotKLpgJror4HliLjnoJTnqbbmiYA=
WB-BGA封装环节成本构成_第2页
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
WB-BGA封装环节成本构成_第3页
WB-BGA封装环节成本构成_第4页
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
WB-BGA封装环节成本构成_第5页
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
所属报告: 兴森科技-公司研究报告-IC载板龙头助力国产先进封装及高算力芯片腾飞-230315(38页).pdf
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