三个皮匠报告—— 严选型全行业研究报告分享下载平台,您的专属行业智库!
欢迎来到三个皮匠报告!
登录
帮助中心
首页
最新
研搜
BETA
合集
英文
会议
数据
财报库
政策库
自研报告
入驻
您的当前位置:
首页
>
行业数据
>
图30.华为昇腾芯片性能与英伟达B300对比
图30.华为昇腾芯片性能与英伟达B300对比
行业数据
下载Excel
下载图片
原图定位
图片属性
图片格式:PNG
图片大小:214KB
图片尺寸:1889*281
同报告图片
/
4
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
所属报告:
电子行业深度分析:国产算力崛起内外双轮驱动下的自主生态突围-260304(57页).pdf
打包全文图表
相关数据
B200/B300等算力芯片将采用CoWoS-L封装
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
收藏
行业数据
2026-01-12
原图定位
查看详情
英伟达GB300机柜架构(左图)以及B300芯片/Computetray/Switchtray(右图)
fCDnu4Tku7blkI3np7AgICAgICAgICAgICAgICB8IOaVsOmHjyB8CnwtLS0tLS0tLS0tLS0tLS0tLS0tLS0tLS18LS0tLS0tfAp8IFNOMjIwMSgxR0JlKSAgICAgICAgICAgfCAyICAgIHwKfCAxUlUgUG93ZXIgc2hlbGYgMzNrICAgIHwgMyAgICB8CnwgQ29tcHV0ZSB0cmF5cyAgICAgICAgICB8IDEwICAgfAp8IE52bGluayBTd2l0Y2ggdHJheXMgICAgfCA5ICAgIHwKfCBDb21wdXRlIHRyYXlzICAgICAgICAgIHwgOCAgICB8CnwgMVJVIFBvd2VyIHNoZWxmICAgICAgICB8IDMgICAgfAoK6LWE5paZ5p2l5rqQ77yaTlZJRElB77yM5Zu95L+h6K+B5Yi457uP5rWO56CU56m25omA5pW055CG
收藏
行业数据
2025-08-25
原图定位
查看详情
最新数据
全球全年龄段奶粉市场规模(亿美元)
收藏
行业数据
2026-07-30
原图定位
查看详情
全球酸奶及发酵乳制品市场规模(亿美元)
收藏
行业数据
2026-07-30
原图定位
查看详情
全球药用级益生菌市场规模(百万美元)
收藏
行业数据
2026-07-30
原图定位
查看详情
全球益生菌膳食补充剂市场规模及增速
收藏
行业数据
2026-07-30
原图定位
查看详情
全球拥有AKK专利菌株的核心企业
收藏
行业数据
2026-07-30
原图定位
查看详情
在AI芯片性能层面,华为昇腾系列已形成覆盖训练与推理的完整产品矩阵。早期昇腾910/310分别面向数据中心训练与边缘侧推理。25Q1 发布的昇腾 910C 基于 SMIC 第二代 7nm(N+2)工艺,并通过 Chiplet 封装实现性能跃升,在推理场景下性能达到 Nvidia H100 约 60%,已成功支撑 DeepSeek R1 等大模型推理,验证了其商用可行性。展望后续路线图,华为将在2026–2028 年持续推出昇腾 950/960/970 系列,微架构由 SIMD 升级至 SIMD/SIMT,算力由百 TFLOPS 级跃升至多 PFLOPS 级,并在互联带宽、HBM 容量与带宽上持续翻倍,同时自昇腾950 起切换至华为自研 HBM 体系,整体性能与系统能力持续向国际一线产品逼近,成为国产AI 算力体系的核心支柱。
行业数据
原图定位
当前图表所属:
电子行业深度分析:国产算力崛起内外双轮驱动下的自主生态突围-260304(57页).pdf
2026年国产算力行业报告:内外双轮驱动,自主生态加速突围
电子行业深度分析:国产算力崛起内外双轮驱动下的自主生态突围-260304
Chiplet技术所发挥的实际作用
常见的Chiplets技术性能参数
下载图片或Excel,需升级至尊VIP会员或「预见者」VIP
立即去升级
客服
商务合作
小程序
服务号
回到顶部
折叠
微信扫码登录
微信扫码登录
双重福利,扫码领取!
关注公众号『三个皮匠报告』,免费领取报告
1.100+最新优质行业报告
2.每周免费精选报告分享
手机快捷登录
账号登录
记住密码
忘记密码?
验证即登录,未注册将自动创建账号
获取验证码
收不到验证码注意事项
登录代表您已阅读并同意
《三个皮匠服务条款》